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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
PACKAGE
H11C3
H11C4
H11C5
H11C6
SCHEMATIC
ANODE 1
6 GATE
6 1
6
CATHODE 2 5 ANODE
1
N/C 3
4 CATHODE
6 1
DESCRIPTION
The H11C series consists of a gallium-arsenide infrared emitting diode optically coupled with a light activated silicon controlled rectifier in a dual-in-line package
FEATURES
* * * * * High efficiency, low degradation, liquid epitaxial LED Underwriters Laboratory (UL) recognized fl File #E90700 VDE recognized (File #94766) - ordering option .300. (e.g., H11C1.300) 200V/400V Peak blocking voltage High isolation voltage - 5300V AC (RMS)
APPLICATIONS
* * * * * * * * * Low power logic circuits Telecommunications equipment Portable electronics Solid state relays Interfacing coupling systems of different potentials and impedances. 10 A, T2L compatible, solid state relay 25 W logic indicator lamp driver 200 V symmetrical transistor coupler (H11C1, H11C2, H11C3) 400 V symmetrical transistor coupler (H11C4, H11C5, H11C6)
(c) 2003 Fairchild Semiconductor Corporation
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H11C1
Parameter TOTAL DEVICE Storage Temperature Operating Temperature
H11C2
H11C3
Symbol
H11C4
Device
H11C5
Value
H11C6
Units
TSTG TOPR TSOL IF VR IF(pk) PD
All All All All All All All
-55 to +150 -55 to +100 260 for 10 sec 60 6 3.0 100 1.33 400 5.3 1 13.3 6 300 10 5 200 400
C C C mA V A mW mW/C mW mW/C W mW/C V mA A A V V
Lead Solder Temperature EMITTER Continuous Forward Current Reverse Voltage Forward Current - Peak (1 s pulse, 300 pps) LED Power Dissipation Derate above 25C DETECTOR Power Dissipation (ambient) Derate linearly above 25C ambient Power Dissipation (case) Derate linearly above 25C case Peak Reverse Gate Voltage RMS On-State Current Peak On-State Current (100 S, 1% duty cycle) Surge Current (10ms) Peak Forward Voltage Peak Forward Voltage
PD PD VGR IDM (RMS) IDM (Peak) IDM (Surge) VDM VDM
All All All All All All H11C1, H11C2, H11C3 H11C4, H11C5, H11C6
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter EMITTER Input Forward Voltage Reverse Leakage Current Capacitance DETECTOR Off-State Voltage Reverse Voltage On-State Voltage RGK = 10k, TA = 100C, ID = 50A RGK = 10k, TA = 100C, ID = 150A RGK = 10k,TA = 100C, IR = 50A RGK = 10k,TA = 100C, IR = 150A ITM = 300 mA VDM = 200V, TA = 100C, IF = 0 mA, RGK = 10k VDM = 400V, TA = 100C, IF = 0 mA, RGK = 10k VRM = 200 V, TA = 100 C, IF = 0 mA, RGK = 10k VRM = 400 V, TA = 100 C, IF = 0 mA, RGK = 10k VDM VRM VTM H11C1, H11C2, H11C3 H11C4, H11C5, H11C6 H11C1, H11C2, H11C3 H11C4, H11C5, H11C6 All H11C1, H11C2, H11C3 IDM H11C4, H11C5, H11C6 H11C1, H11C2, H11C3 IRM H11C4, H11C5, H11C6 150 150 50 A 200 400 200 400 1.2 1.3 50 V V V A IF = 10 mA VR = 3 V VF = 0 V, f = 1.0 MHz VF IR CJ All All All 50 1.2 1.5 10 V A pF Test Conditions Symbol Device Min Typ* Max Unit
Off-State Current
Reverse Current
TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specified.)
Characteristics Test Conditions VAK = 50 V, RGK = 10 k Input Current to Trigger VAK = 100 V, RGK = 27 k Coupled dv/dt, input to output (figure 8) *Typical values at TA = 25C IFT Symbol Device H11C1,H11C2, H11C4, H11C5 H11C3, H11C6 H11C1,H11C2, H11C4, H11C5 H11C3, H11C6 dv/dt ALL 500 Min Typ* Max 20 30 11 14 V/S mA Units
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ISOLATION CHARACTERISTICS
Characteristic Isolation Voltage Isolation Resistance Isolation Capacitance *Typical values at TA = 25C Note 1. For this test, LED pins 1 and 2 are common, and SCR pins 4, 5 and 6 are common. Test Conditions (t = 1 min.) (note 1) (note 1) (VI-O = 500 VDC) (note 1) (f = 1 MHz, VI-O = 0) Symbol VISO RISO CI-O Min 5300 1011 0.8 Typ* Max Units V pF
(c) 2003 Fairchild Semiconductor Corporation
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H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Figure 1. LED Forward Current vs. Forward Voltage
100
Figure 2. Trigger Current vs Anode-Cathode Voltage
100
10
IFT , NORMALIZED TRIGGER CURRENT
R GK = 300 ohm
FORWARD CURRENT - IF (mA)
10 R GK = 1K
TA = 25C TA = 100C 1 TA = -40C
R GK = 10K 1 R GK = 27K RGK = 56K NORMALIZED TO VAK = 50V R GK = 10K 0.1 TA = 25oC 1 10 100
0.1 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
FORWARD VOLTAGE - VF (V)
VAK, ANODE-CATHODE VOLTAGE (V)
Figure 3. Input Trigger Current vs. Temperature
1000
Figure 4. Off-State Current vs. Temperature
R GK = 300 ohm 10 R GK = 1K
I DM , OFF-STATE FORWARD CURRENT, NORMALIZED
IFT , INPUT TRIGGER CURRENT, NORMALIZED
100
VAK = 400V 10
R GK = 10K 1 R GK = 27K
VAK = 200V 1 VAK = 50V
0.1 -60
NORMALIZED TO TA = 25 oC R GK = 10K VAK = 50V -40 -20 0 20
R GK = 56K
40
60
80
100
NORMALIZED TO TA = 25oC VAK = 50V 0.1 0 20 40 60
o
TA, AMBIENT TEMPERATURE ( oC)
80
100
T A, AMBIENT TEMPERATURE ( C)
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Figure 6. On-State Characteristics
1000
Figure 5. Forward Blocking Voltage, VDM vs. Temperature
700
650
V DM , FORWARD BLOCKING VOLTAGE (V)
600
ON-STATE CURRENT - ITM (mA)
R GK = 10K, 20K
100
550 R GK = 50K 500 R GK = 100K 450
TA = 25 C TA = 100 C 10
400
350
300 0 20 40 60 80 100 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0
TA , AMBIENT TEMPERATURE ( C)
o
ON-STATE VOLTAGE - VTM (V)
Figure 7. Holding Current, IH vs. Temperature
10000
RGK = 300 ohm
IH , HOLDING CURRENT (A)
1000
RGK = 1K
RGK = 10K 100 RGK = 27K RGK = 56K
10 -60
-40
-20
0
20
40
o
60
80
100
T A, AMBIENT TEMPERATURE ( C)
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
TYPICAL APPLICATIONS
10A, T2L COMPATIBLE, SOLID STATE RELAY Use of the H11C4 for high sensitivity, 5300 V isolation capability, provides this highly reliable solid state relay design. This design is compatible with 74, 74S and 74H series T2L logic systems inputs and 120V AC (H11C1, H11C2, H11C3) or 220V AC (H11C4, H11C5, H11C6) loads up to 10A.
47 470 +5V H11CX "COIL" SC146D 56K 0.1 F "CONTACT" 120 VAC (H11C1, H11C2, H11C3) 220 VAC (H11C4, H11C5, H11C6) 100 LOAD
IN5060 (4)
47
25W, LOGIC INDICATOR LAMP DRIVER
INDICATOR LAMP
The high surge capability and non-reactive input characteristics of the H11C allow it to directly couple, without buffers, T2L and DTL logic to indicator alarm devices, without danger of introducing noise and logic glitches.
470 +5V H11CX 100
LOGIC INPUT 56K
120 VAC (H11C1, H11C2, H11C3) 220 VAC (H11C4, H11C5, H11C6)
0.1 F
200V/400V SYMMETRICAL TRANSISTOR COUPLER Use of the high voltage PNP portion of the H11C provides a 400V transistor capable of conducting positive and negative signals with current transfer ratios of over 1%. This function is useful in remote instrumentation, high voltage power supplies and test equipment. Care should be taken not to exceed the H11C 400mW power dissipation rating when used at high voltages.
H11CX INPUT OUTPUT
+100 VAC Vp = 800 Volts tp = .010 Seconds f = 25 Hertz TA = 25 C H11C4 + Vp Vp .63 Vp tp dv / dt EXPONENTIAL RAMP GEN. 10 K OSCILLOSCOPE H 100
Fig. 8 Coupled dv/dt - Test Circuit
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Package Dimensions (Through Hole)
PIN 1 ID.
Package Dimensions (Surface Mount)
0.350 (8.89) 0.330 (8.38)
3
2
1
0.270 (6.86) 0.240 (6.10)
PIN 1 ID.
0.270 (6.86) 0.240 (6.10)
SEATING PLANE
0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14)
4
5
6
0.070 (1.78) 0.045 (1.14)
0.300 (7.62) TYP
0.200 (5.08) 0.115 (2.92)
0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN 0.100 (2.54) TYP
0.016 (0.41) 0.008 (0.20)
0.154 (3.90) 0.100 (2.54)
0.020 (0.51) MIN 0.016 (0.40) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41)
0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP
0 to 15
0.300 (7.62) TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4" Lead Spacing)
Recommended Pad Layout for Surface Mount Leadform
0.270 (6.86) 0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14)
0.415 (10.54)
0.100 (2.54) 0.295 (7.49) 0.030 (0.76)
SEATING PLANE
0.200 (5.08) 0.135 (3.43)
0.154 (3.90) 0.100 (2.54)
0.004 (0.10) MIN
0.016 (0.40) 0.008 (0.20)
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP
0 to 15 0.400 (10.16) TYP
Note All dimensions are in inches (millimeters)
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
ORDERING INFORMATION
Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape and Reel
MARKING INFORMATION
1
H11C1 V XX YY K
3 4 5
2 6
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) Two digit year code, e.g., `03' Two digit work week ranging from `01' to `53' Assembly package code
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
Carrier Tape Specifications
12.0 0.1 4.85 0.20 0.30 0.05 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10
7.5 0.1 13.2 0.2 9.55 0.20 16.0 0.3
0.1 MAX
10.30 0.20
O1.6 0.1
User Direction of Feed
NOTE All dimensions are in inches (millimeters) Reflow Profile (Black Package, No Suffix)
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 225 C peak
215C, 10-30 s
Time above 183C, 60-150 sec
Ramp up = 3C/sec 3.5 4 4.5
* Peak reflow temperature: 225C (package surface temperature) * Time of temperature higher than 183C for 60-150 seconds * One time soldering reflow is recommended
Time (Minute)
(c) 2003 Fairchild Semiconductor Corporation
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PHOTO SCR OPTOCOUPLERS
H11C1
H11C2
H11C3
H11C4
H11C5
H11C6
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
Page 11 of 11
3/19/03

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